Semiconductor Packaging News
WEBAnalysts warn of Intel’s dependence on CHIPS funding. CHIPS Month Canada is uniting the country's semiconductor sector with events across October, building on growing momentum. Doug Suerich, chair of CHIPS Month, highlights Canada’s potential to fill U.S. advanced packaging needs and capitalize on the CHIPS Act.
Semiconductor Packaging News
WEBThe semiconductor industry is crucial for global growth sectors like AI, cloud computing, and defense. In response, the EU and U.S. have enacted "chips acts" to boost domestic production, aiming for semiconductor sovereignty by 2030 amid geopolitical tensions and market challenges. EE Times Europe. Chipzilla back on death row.
Semiconductor Packaging News
WEBBroadcom says it will sell $12 billion in AI parts and custom chips this year. Broadcom exceeded Wall Street's third-quarter expectations for revenue and earnings, but a $1.88 billion net loss from a tax provision led to a 7% drop in shares. Despite strong AI and semiconductor sales, revenue guidance met expectations at $14 billion.
Semiconductor Packaging News Index
WEBSemiconductor Engineering. Sep 20, 2024. SUMMARY. Advanced Packaging Drives New Memory Solutions for the AI Era. AI is fueling demand for more computing power and advanced memory technologies like High-Bandwidth Memory (HBM). Lam Research, a leader ... EE Times. Sep 20, 2024. SUMMARY.
Semiconductor Packaging News Technical Paper Index
WEBORC Manufacturing CO., LTD. Jul 31, 2024. Advanced Packaging for Next-Generation Vehicle. Automotive processors are swiftly adopting advanced semiconductor technologies, including 5 nm and 3 nm processes. This shift necessitates advanced packaging ... Amkor Technology, Inc. Jul 24, 2024.
Will 2024 be the Year of Advanced Packaging?
WEBWill 2024 be the Year of Advanced Packaging? IDTechEx's report highlights how advanced packaging technologies like 2.5D & 3D are boosting semiconductor innovation. These methods improve chiplet integration & system performance, paving the way for breakthroughs in AI, 5G & data centers despite material & cost challenges.
CHIPS Subsidy Boosts Advanced Packaging in U.S.
WEBA $1.6 billion CHIPS Act subsidy aims to boost U.S. advanced-packaging capacity. Taiwan's ASE and others double California capacity to support AMD, Apple, and Nvidia. The U.S. Department of Commerce launches a competition to spur R&D in energy-efficient tech. The dedicated team at Semiconductor Packaging News has provided this …
TSMC Begins Small-Scale Production in Arizona for Apple's A16 …
WEB3 days ago · TSMC's Arizona fab has started trial production of Apple's A16 chip using the 5nm N4P process, a significant milestone. Tim Culpan reports the facility aims to scale up once Phase 1 is complete, with mass production set for 2025. The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.
How Water Scarcity Threatens Taiwan’s Semiconductor Industry
WEB4 hours ago · Taiwan leads global chip manufacturing but faces a critical vulnerability: water scarcity. Semiconductor production requires vast amounts of water, and climate change-induced droughts threaten future output. Despite efforts like recycling and new desalination plants, Taiwan must rethink water management to …
Revamping the Semiconductor Industry with Hybrid Bonding
WEB4 hours ago · Revamping the Semiconductor Industry with Hybrid Bonding. Hybrid bonding, or direct-bond interconnect, is set to revolutionize the semiconductor industry as it addresses limitations of traditional packaging. By enabling smaller interconnects and efficient signal transmission, this technology facilitates …
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