EPAM Systems unveils DIAL 3.0, a powerful open-source platform aimed at reshaping how businesses adopt and scale Generative ...

Estimated market potential for advanced packaging of more than EUR 69 billion by 2029; 2.5/3D, Flip Chip and ...

Calibre 3DStress from Siemens Digital delivers the early analysis and simulation of chip/package interactions at all stages ...

With intelligent control systems, iwell addresses the increasing challenges related to grid congestion; application-oriented ...

India is pioneering quantum communication with ISRO and DRDO, leveraging QKD to safeguard national security, banking, and ...

Leverages Empower’s FinFast technology and vertical power delivery architecture to provide system designers with ...

To cope with stringent reliability constraints required to maximize productivity of complex drilling operations in severe ...

Partnership between BrainChip and HaiLa reflects future of smart edge devices—where sensor intelligence, connectivity, and compute are optimized for power ...

CDK Sandeep Jain on how Hybrid Intelligence and India’s IT talent are reshaping auto dealerships through AI-driven, ...

From BTech in Design to global MTech programs in Abu Dhabi, IIT Delhi’s 2025 curriculum overhaul empowers students with ...

Yole Group’s new report, Status of the Semiconductor Foundry Industry, explores geopolitical, economic, and capacity ...

This collaboration will benefit institutions of higher learning in multiple ways as it results in innovative ideas, and ...